| 摘要 |
<p>This invention provides a high-density planar contact array capable of interconnecting various electronic devices using a pad to pad approach or pad to pin, which is capable of accommodating non-coplanarity in the Z axis of printed circuit boards but which still maintains good electrical contact. The array comprises an insulative substrate sheet (10) that has a plurality of parallel conductive lines (40) terminating in a pad (41) over a hole (42) in the substrate (10).</p> |
