| 摘要 |
In an IC card having an electronic part comprising an IC chip mounted to a substrate, the electronic part is arranged outside a loop of an antenna coil. A reinforcement plate is provided to surround an outer peripheral edge of the IC chip on a side, on which the IC chip is mounted. A non-contact type IC card is formed by filling a semi-solid fixed resin in a resin hole defined by a spacer, which has a hole larger than an outside area of the IC card and thicker than a height of the electronic part, and a resin film, embedding the electronic part and the antenna coil in the fixed resin for temporary fixation, hardening the fixed resin with the film in pressure contact with at least one side of the fixed resin and punching portions of the fixed resin and the film at a time. |
