摘要 |
<p>A method of connecting a semiconductor chip assembly (12) having at least first and second contacts (18) to a connection component (20) including at least first and second connection leads (30) by means of a tool (60) consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component (20) is juxtaposed with the semiconductor chip assembly (12) so that the first and second connection leads (30) are aligned with the first and second contacts (18) in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool (60) substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space (A1) is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool (60) substantially downwardly and towards the second contact in the second direction.</p> |