发明名称 |
COMPLIANT INTERFACE FOR A SEMICONDUCTOR CHIP |
摘要 |
A method and an apparatus for providing a planar and compliant interface between a semiconductor chip (120) and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads (110) defining channels (117) between adjacent pads. The pads are typically compressed between a flexible film chip carrier (100) and the chip. A compliant filler (170) is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness. |
申请公布号 |
WO9609746(A1) |
申请公布日期 |
1996.03.28 |
申请号 |
WO1995US11933 |
申请日期 |
1995.09.20 |
申请人 |
TESSERA, INC. |
发明人 |
KOVAC, ZLATA;MITCHELL, CRAIG;DISTEFANO, THOMAS |
分类号 |
H01L23/12;H01L21/56;H01L21/60;H01L23/28;H01L23/48;H01L23/498;H05K1/11;H05K3/36;H05K3/40 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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