The socket contains to surrounding support structures (1) with a guide slot (5), on which are formed holding structures. First a flat substrate (3) with a conductive surface is formed, and the latter is coated with a film of a radiation sensitive plastics, covered by an electrically conductive layer. The conductive layer is so structured that it is removed from or covered on locations mat lying between the support structures and in the guide slot region. Then the prominent faces of the support structures on the substrate are freed by irradiation and development and galvanically metal plated. Then the radiation sensitive plastics is completely removed.
