| 摘要 |
<p>PURPOSE:To obtain the regenerated tile having elasticity, water permeability and electrolytic corrosion resistance by crushing thermosetting resin waste contg. silica particles of >=99% purity generated in the production of semiconductors, etc., as fillers to chips, adding liquid rubber thereto and subjecting the chips to pressurized molding under heating. CONSTITUTION:The thermoplastic resin waste contg. the silica particles of >=99% purity is cut and crushed by, for example, a crusher of a cutter type. The liquid rubber is added as a binder thereto preferably at <=10wt.% and is mixed with a mixer. The resulted semifluid mixture is put into metallic molds and is molded for 1 to 30 minutes under 5 to 50kg/cm<2> and at 100 to 400 deg.C, by which the regenerated tile is obtd.</p> |
