| 发明名称 |
Process of manufacturing a structure having a thin semiconductor layer on a substrate |
| 摘要 |
<p>Prodn. of a target substrate, coated with an adherent semiconductive thin film, involves (a) coating a first substrate with the thin film which is bonded to the substrate with a bonding energy EO; and (b) transferring the thin film (4) from the first substrate to the target substrate (24) by detaching the thin film, using detachment forces which overcome the bonding energy EO, and adhering the thin film to the target substrate.</p> |
| 申请公布号 |
EP0703609(A1) |
申请公布日期 |
1996.03.27 |
| 申请号 |
EP19950402122 |
申请日期 |
1995.09.20 |
| 申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
BRUEL, MICHEL;POUMEYROL, THIERRY |
| 分类号 |
H01L27/12;H01L21/02;H01L21/762;(IPC1-7):H01L21/762;H01L21/20 |
主分类号 |
H01L27/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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