| 摘要 |
PURPOSE: To decrease the impedance of a metal wire with a simple process and to reduce cost by providing a metal spherical body with the metal wire which is bonded onto a metal rib and is extended from an upper part and at the same time bonding the metal wire to an electrode pad. CONSTITUTION: A metal spherical body 14 is bonded to a metal rib 16 and at the same time a gold wire 14a extended from the upper portion of the metal spherical body 14 is bonded to source electrode pads 18a and 18b. The height dimension of the metal spherical body 14 is formed to be as thick as a semiconductor device 15. In terms of the manufacturing method, first the metal spherical body 14 is formed, the metal spherical body 14 is pressed against the metal rib 16 by a capillary 31, and then a first bonding is performed. After that, the capillary 31 is pulled up and the gold wire 14a is extended from the upper portion of the metal spherical body 14. Then, the gold wire 14a is cut at the position of the source electrode pad 18b of the semiconductor device 15 and the gold wire 14a is pressed against the source electrode pad 18b for performing second bonding. |
