发明名称 Buffing apparatus suitable to buff thin plate work and controlling method for the apparatus
摘要 A buffing apparatus which can buff a thin plate work without causing buckling. The buffing apparatus comprises a plurality of buffing rolls removably secured in a predetermined spaced relationship from each other to a shaft which is driven to rotate, a backup roll disposed in parallel to the buffing rolls and extending over the overall length of all of the buffing rolls, and a holding roll disposed at least between each adjacent ones of the buffing rolls. The holding roll is positioned such that the axis thereof is positioned on a straight line interconnecting the center of transverse section of one of the buffing rolls and the center of a transverse section of the backup roll and an outer periphery thereof substantially contacts with a contacting plane of the buffing rolls.
申请公布号 US5501629(A) 申请公布日期 1996.03.26
申请号 US19930117928 申请日期 1993.09.08
申请人 FUJITSU LIMITED 发明人 KAWANA, EISHIROU;OGAWA, HITOSHI;ISHIDA, KOICHI;AOKI, KAZUO
分类号 B24B7/12;B24B29/06;H05K3/26;(IPC1-7):B24B1/00 主分类号 B24B7/12
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