| 摘要 |
<p>The semiconductor package comprises leads equipped with a rear surface of a first semiconductor chip, wires for the connection of bonding pads of the chip and leads, an anisotropic electroconductive layer bonded to the lower of the leads, a second semiconductor chip equipped with a front surface on the lower of the electroconductive layer, and a package body for the protection of the chips and the wires. The electroconductive layer is blended with an insulating material i.e. rubber and a metal powder, and the package body is molded with an epoxy molding compound. The semiconductor package increases a memory capacity.</p> |
