| 摘要 |
In an optical semiconductor device having a light emitting element mounted on a heat sink, a first casing for supporting and covering the light emitting element and the heat sink, and a second casing for supporting and covering the first casing and further having output leads extended externally, a laminated ceramic substrate provided with a conductive pattern having one end connected to the light emitting element and the heat sink and the other end connected to the output leads is provided as a part of the first casing so as to partially replace a wall of the first casing with the laminated ceramic substrate. Since leads extending from the first outer casing and leads extending from the second outer casing are connected by a laminated ceramic substrate formed with a conductive pattern within the device, it is possible to freely determine the arrangement direction and the number of the leads while maintaining the hermetic characteristics of the heat sink, thus enabling the electric circuit elements to be integrated on the laminated ceramic substrate. |
