| 摘要 |
PURPOSE: To improve the throughput of a substrate treating device at the time of manufacturing a semiconductor element, etc., by reducing the number of carrying shafts and shortening the wafer exchanging time, and then, simplifying or omitting a pre-alignment mechanism in an exposing device. CONSTITUTION: After a wafer 10 is taken out from a cassette 9 by means of a carrying arm 12, the wafer 10 is moved to a photoresist applying section 18 by moving the arm 12 along a slider main body 11 and a photoresist is applied to the wafer 10. Then the wafer 10 is centered at an angular position by a positioning section 17 and loaded in the same state on the wafer holder 31 of a projection exposing device 21 trough the arm 12. After exposure, the wafer 10 is unloaded from the holder 31 by means of a carrying arm 38 on a developing device 36 side by moving the holder 31 in +X direction. |
