| 摘要 |
PURPOSE: To obtain a semiconductor device and production method therefor in which no bubble is generated in the sealing resin and the semiconductor device is protected against adhesion of dust or damage. CONSTITUTION: In the semiconductor device, the sealing resin 4 covering a semiconductor element 10 and a bonding wire 3 comprises a first sealing resin 41 of one hardness provided at least above an optical element part 11, and a second sealing resin 42 of lower hardness provided at the part other than the first sealing resin 41. After mounting the semiconductor element 10, the first sealing resin 41 is dripped through a first nozzle disposed above the optical element part 11 while simultaneously the second sealing resin 42 is dripped through a second nozzle disposed contiguously to the first nozzle. |
