| 摘要 |
PURPOSE: To facilitate the package capable of making any other electronic part reflow simultaneously by a method wherein surface side terminals electrically connecting to respective connecting terminals are arranged while a.resin layer is provided with aperture parts exposing the surface side terminals for cutting down part numbers. CONSTITUTION: A semiconductor chip 1 is arranged on the upper surface through the intermediary of a chip connecting terminal 2. On the rear surface, a wiring board 3 whereon substrate connecting terminals 4 are arranged and a resin layer 15 at least covering the chip connecting terminal 2 and the upper surface of the wiring board 3 is provided on the region imposing to the region excluding the semiconductor chip 1 mounting region on the upper surface. Besides, on the upper surface of the wiring board 3,upper surface side terminals 19 electrically connecting to respective substrate terminals 4 are arranged on the position opposite to the substrate connecting terminals 4. Furthermore, the resin layer 15 provided with aperture parts 16 for exposing the upper surface side terminals 19 is formed in a honeycomb structure. Through these procedures, the part numbers and assembling step numbers can be cut down, thereby enabling the title semiconductor packages to be connected and mounted meeting the solder reflowing requirements for the other electronic parts. |
