发明名称 PACKAGE LEAD FRAME FOR OPTICAL COUPLER AND ITS METHOD
摘要 PROBLEM TO BE SOLVED: To provide a small-area surface-mounting package having a single surface lead frame architecture, in which many pairs of optically coupled element dies can be housed. SOLUTION: An element, consisting of multipairs of photocouplers, can be arranged on a minimum-sized footprint package on the architecture of a lead frame. A detector flag 20 and an LED flag 12 are arranged on the common center line 26 in a footprint. A critical length is determined with respect to the package factor along the center line. An optical coupler pair is housed in a package by controlling an angle 28, formed between the center line and an axis 24 in the longitudinal direction. The angle 28 is computed by having the arc-sine function obtained, by deducting the width of the footprint from the critical length.
申请公布号 JPH0878723(A) 申请公布日期 1996.03.22
申请号 JP19950229617 申请日期 1995.08.16
申请人 MOTOROLA INC 发明人 KUREMU ETSUCHI BURAUN;JIYON II SARINA
分类号 H01L31/12;H01L23/495;H01L31/167 主分类号 H01L31/12
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