| 摘要 |
<p>PURPOSE: To accomplish the title mounting structure of small type having excellent heat dissipating property and shock-resisting property by a method wherein a junction substrate, having a protrusion-fitting hole, is junctioned to the surface of a wiring substrate, and an integrated circuit substrate is junctioned to the surface reverse to the surface where the wiring substrate of the junction substrate is connected. CONSTITUTION: Holes 3 are formed on a metal plate 2, bonding pad groups 5, which are junctioned to an LSI chip 1, are formed in the holes 3, and the protruding parts of a multilayer ceramic substrate 4 are fitted to the holes 3. The LSI chip 1 can be electrically connected to the multilayer ceramic substrate 4 by providing wire bonding on the bonding pad groups 5, which are formed on the protruding part of the multilayer ceramic substrate 4 having a wire 6, and the electrode 7 on the LSI chip 1. As the heat generated on the LSI chip 1 spreads to the whole body of the metal plate 2 without passing through the multilayer ceramic substrate 4, the heat can be relieved efficiently into the air from the entire metal plate 2.</p> |
