| 摘要 |
PURPOSE: To provide a high-reliability semiconductor chip housing use package having a structure, wherein heat which is generated from a semiconductor chip, which is housed in the interior of an insulating container, at the time of operation of the chip is favorably dissipated to the outside and the chip is always held at a low temperature and can be actuated normally and stably extending over a long period of time. CONSTITUTION: A semiconductor chip housing use package has a structure, wherein a flat plate-shaped radiator 9 is soldered to the surface of an insulating container 4 with a semiconductor chip 3 housed in its interior and in this package, with through holes H provided in the thickness direction of the radiator 9, a brazing metal 10 is in the holes H. |
