SEMICONDUCTOR DEVICE AND ASSEMBLING SYSTEM THEREFOR

摘要

PURPOSE: To increase the degree of freedom in the arrangement of pads on a semiconductor chip by a constitution wherein the bed part of an inner lead is not arranged on the semiconductor chip. CONSTITUTION: In a semiconductor device where signal I/O pads 25 arranged on a semiconductor chip 3 are connected through a wire 7 with leads 5b for inputting an external signal to the semiconductor chip 3 having one ends arranged on the inside of an outer case, the leads 5b have forward end parts arranged on the semiconductor chip 3 and the joint of the lead 5b and the wire 7 is not arranged on the semiconductor chip 3.