| 摘要 |
<p>PURPOSE: To ensure that an Al wiring layer in the periphery of a substrate is not corroded by an alkali developer when a resist after exposure is treated with the alkali developer. CONSTITUTION: A barrier metal film 4 is formed on a substrate 1, the substrate 1 is held on a stage 6 by a clamp ring 5 as if covering the barrier metal film 4 outside an element effective region of the periphery of the substrate 1, an aluminum-containing film 7 is formed on the barrier metal film 4 in the element effective region, the clamp ring 5 is removed from the substrate 1, and a reflection preventing film 8, whose reflectivity is lower than that of the aluminium- containing film 7, is formed as if covering the aluminum-containing film 7.</p> |
