| 摘要 |
<p>PURPOSE: To reduce the thickness of a chip itself and that of resin covering a surface with no circuit. by a method wherein after packaging, resin covering the back of an LSI is eliminated, and further the back of the LSI is eliminated. CONSTITUTION: In an LOC structure storage device, the space between a chip l and lead frames 2 fixed on the chip 1 by using adhesive tapes 5 is interconnected by wires 4 and sealed by resin 3. When thinning work is performed, resin 3 under an LSI chip 1 is eliminated first. When the work is advanced, the back of the chip 1 is worked. Thereby the total thickness of the packaged storage device is also reduced, mounting density of electronic components can be improved, and miniaturization of an electronic apparatus is enabled.</p> |
