| 摘要 |
PURPOSE: To provide a semiconductor device manufactured into a structure, wherein even in the case where the productivity of the device is increased by forming a package using a thermoplastic resin, lead wires and the like can be prevented from being disconnected and the reliability of the device can be ensured. CONSTITUTION: In a semiconductor device 10 constituted into a structure, wherein a carrier member 21 mounted with a semiconductor device 20 is provided in the interior of a package, the package is provided with an outer side part 30, which is formed into a hallow vessel form and consists of a thermoplastic resin, and an inner side part 40, which is:'. housed in the outer side part 30 and consists of a thermosetting resin. |
