| 摘要 |
PURPOSE: To provide a low temperature baking multilayered circuit board which can improve printing properties of conductor turning to inner wiring and viahole conductor, and reduce imperfect electric conduction. CONSTITUTION: In a laminate 1 formed by laminating insulating layers 1a-1e composed of glass-ceramics, inner wirings 2b-2e whose main component is low resistance metal material are arranged between the layeres 1a-1e, and viahole conductors 3a-3e which penetrate the thickness direction between the layers 1a-1e are arranged. In the above low temperature baking multilayered board 1, at least the viahole conductors 3a-3e are composed of sintered bodies of deformed sphere type conductive powder and inorganic binder. |
