| 摘要 |
PURPOSE: To lower a mold temperature and reduce a cooling time when a substrate is to be produced by an injection molding method by a method wherein a stamper whose trench depth is slightly deeper than the depth of the transcription trenche of the substrate is used. CONSTITUTION: A stamper whose trench depth D is 1.1-1.7 times the depths (d) of the transcription trenches of a substrate to be obtained is used. In other words, a transcription factor (the ratio of the depths (d) of the transcription trenches of a substrate A to the depth D of the trench of a stamper) is 60-90%. If the stamper whose D/d is less than 1.1, a mold temperature can not be reduced below 100 deg.C. On the other hand, the stamper whose D/d exceeds 1.7 is not practical. The stamper 6 whose D/d is 1.1-1.7 (the transcription factor is 60-90%) is preferable and, more particularly, the stamper 6 whose D/d is 1.1-1.25 (the transcription factor is 80-90%) is preferable. The stamper is suitable for the manufacture of the substrate whose transcription trench depth (d) is 1300-2000Å. The width of the spiral trench of the stamper 6 is normally 0.4-0.6μm and the trench pitch is normally 1.5-1.7μm.
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