| 摘要 |
PURPOSE: To obtain an LSI designing system which determines a connection diagram of bonding wire for realizing a thin and small-sized package. CONSTITUTION: The LSI designing system for determining a connection diagram between an IC chip and a frame comprises a section 3 for synthesizing three- dimensional design data for the IC chip and the frame to determine a diagram which can be indicated three-dimensionally. The data synthesizing section 3 is connected with a section 4 for determining a three-dimensional connection diagram between the pad on the IC chip and the frame based on a diagram synthesized using a loop data prepared at a loop data designing section 5. The connection diagram determining section 4 is sequentially connected with a bonding rule check section 6 and a loop profile check section 7. The connection diagram is then collated with two-dimensional and three-dimensional connection rules and a connection diagram satisfying the connection rule is stored in a completed connection diagram storing section 8. |
