| 摘要 |
PURPOSE: To form a highly reliable contact having small using area easily. CONSTITUTION: A wiring metal 7 is deposited on an insulation film, i.e., a photosensitive resin 4, formed on the surface of a semiconductor substrate 1. The wiring is then brought into contact with the semiconductor substrate through a contact hole 6 opened through the photosensitive resin 4. When a metal having Young's modulus of 1×10<11> N/m<2> or above, e.g. Nb, Mo, W or Ti, is employed, the contact hole part is tapered and a contact can be formed easily with high step coverage.
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