| 摘要 |
PURPOSE: To realize the enhancement of heat radiation ability for a multi-chip module made of semiconductor chips mounted to both the upper and lower surfaces of a substrate. CONSTITUTION: This module comprises a ceramic substrate 40 made of AlN, chips 32-1 and 32-2 mounted on the upper surface of said substrate by a flip chip method, chips 32-3 and 32-4 attached by dies to the lower surface of the substrate, first thermal conduction blocks 33-1 and 33-2 bonded to the top of the chips 32-1 and 32-2 , a second thermal conduction block 34-1 and the like adhered to the upper surface of the substrate, a resin package 35, and a heat sink 36 bonded to the upper surface of the resin package in tight adhesion with the first thermal conduction blocks and the second thermal conduction blocks. Heat generated at the chips 32-1 and 32-2 moves to the heat sink through the first thermal conduction block and is radiated. Heat generated at the chips 32-3 and 32-4 moves to the heat sink through the substrate 40 and the second thermal conduction block and is then radiated. |
