发明名称 METAL SURFACE PROTECTING RESIN COMPOSITION, LAMINATED BODY USING SAME AND PRODUCING METHOD OF PRINTED CIRCUIT BOARD
摘要 PURPOSE: To obtain a metal surface protecting resin compsn. undevelopable with a slightly alkaline aq. soln. and removable with a highly alkaline aq. soln. CONSTITUTION: This metal surface protecting resin compsn. contains 100 pts.wt., in total, of 50-80 pts.wt. copolymer having 4-12mol% carboxyl group content and a wt. average mol.wt. of 30,000-400,000 (A) and 20-50 pts.wt. ethylenically unsatd. compd. having >=100 deg.C b.p. under atmospheric pressure (B). The copolymer consists of at least one kind of polymerizable vinyl monomer having a carboxyl group as a 1st monomer, at least one kind of 2nd monomer selected from among alkyl acrylates and alkyl methacrylites each having a 3-8C alkyl group and giving a homopolymer whose glass transition temp. T2 is <=70 deg.C and at least one kind of 3rd monomer selected from among alkyl acrylates, alkyl methacrylates, hydroxyalkyl acrylates and hydroxyalkyl methacrylates each having a 1-2C alkyl group.
申请公布号 JPH0876378(A) 申请公布日期 1996.03.22
申请号 JP19940211007 申请日期 1994.09.05
申请人 HITACHI CHEM CO LTD 发明人 TANAKA YOJI;CHIBA TATSUO;MASAOKA KAZUTAKA;KAKUMARU HAJIME
分类号 G03F7/004;B32B15/08;C08L33/04;G03F7/027;G03F7/033;G03F7/34;H05K3/06;(IPC1-7):G03F7/033 主分类号 G03F7/004
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