METHOD OF APPLYING SOLDER TO CONNECTION SURFACES, AND METHOD OF PRODUCING A SOLDER ALLOY

摘要

Described is a method of applying molten solder to connection surfaces on a substrate, the method including the following steps: the substrate, which has a surface which can be wetted with solder or which has at least one area which can be wetted while the rest cannot, is immersed in an organic liquid medium whose boiling point is the same as or above the melting point of the solder; solder is applied to the surface or the area on the substrate where a terminal is to be formed to produce a solder bump, the quantity of solder to be placed on the connection surface being in the liquid medium at least at the moment when it makes contact with the surface and the temperature of the liquid medium being at or above the melting point of the solder.