发明名称 Elektronischer Packungsmodul.
摘要 A module containing an electronic package (4) provides a housing for cooling and protecting the electronic package. In the housing are two metal shells, a top (1) and a bottom (7) shell, which form a common cavity in which the package (4) is completely embedded without touching the inner walls of the cavity. A flexible thermally conductive foil (2,6) is fixed to each of the shells (1,7). The foil is adjustable to the surface of the package (4) and it is isolated from electrically conductive parts of the package. A cooling liquid (8) fills the gaps between the metal shells (1,7) and the foils (2,6). Flexible isolated circuit means (9) connect the package (4) to the outside of the housing, balancing means (3,5) assure the balancing of pressure and volume between the shells (1,7) and further means firmly hold together the housing. The module may be fixed to a board (11) comprising at least one opening in which the module is inserted. The flexible isolated circuit means (9) are electrically connected to the wiring of the board. <IMAGE>
申请公布号 DE69112389(T2) 申请公布日期 1996.03.21
申请号 DE1991612389T 申请日期 1991.06.06
申请人 INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US 发明人 GRUBER, HARALD, W-7033 HERRENBERG, DE;HORBACH, HEINZ GUENTER, DIPL.-ING., W-7268 GECHINGEN, DE;KOETZLE, GUNTHER, DIPL.-ING., W-7030 BOEBLINGEN, DE;LUDWIG, THOMAS, DIPL.-ING., W-7032 SINDELFINGEN, DE;SCHETTLER, HELMUT, DIPL.-ING., W-7405 DETTENHAUSEN, DE
分类号 H01L23/473;H01L23/34;H01L23/42;H01L25/065;(IPC1-7):H01L25/065;H01L23/44 主分类号 H01L23/473
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