发明名称 ELECTRONIC PARTS MOUNTING APPARATUS
摘要 PURPOSE: To provide an electronic parts mounting apparatus capable of easily mounting electronic parts, without requiring a rigorous supervising control for mounting and crushing a solder paste. CONSTITUTION: Electronic parts are clamped by a vacuum nozzle at a feeder, carried to desired place on a board e.g. printed circuit board or ceramic board and mounted on the board by releasing from the suction, and the nozzle returns to the original position. This is repeated. A solenoid coil 138 is coupled with a Z-axis table 108 and armature 140 is coupled with the vacuum nozzle 143 to electromagnetically couple the table with the nozzle through a track type actuator 136. When a solder paste contacts with a lead terminal, the gap between the coil and armature expands due to the reaction exerted on the nozzle from the paste whereby the electromagnetic force between both is reduced to avoid exerting a pressing force on the lead terminal from the paste and hence the paste is not crushed by the terminal.
申请公布号 JPH0878891(A) 申请公布日期 1996.03.22
申请号 JP19940214712 申请日期 1994.09.08
申请人 HITACHI TECHNO ENG CO LTD 发明人 TAKAHASHI KENICHI
分类号 B23P21/00;H05K13/04 主分类号 B23P21/00
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