ELECTRONIC SYSTEM CIRCUIT PACKAGE

摘要

An electronic system package is disclosed herein. The package utilizes a lead frame having an electrically conductive component support segment (52) incorporating provisions for mounting a plurality of electronic components directly on the support segment (52) in accordance with a predetermined circuit design. The circuit package is then encapsulated in a dielectric medium (96). In a preferred embodiment, at least some of the electronic components are mounted direclty to electrically isolated subsegments (52A-52J) of the component support segment and electrically interconnected through their respective subsegments to other components.