| 摘要 |
The present invention is a novel remoistenable adhesive and an improvement in the bonding method for an envelope, a stamp, a sticker, a packaging tape or a label using a remoistenable adhesive, wherein the remoistenable adhesive is a hot melt consisting of a thermoplastic polyamide prepared from an acid component selected from the group consisting of adipic acid, pimelic acid, azelaic acid, suberic acid and sebacic acid, and an alkyleneoxy diamine component consisting of one or more diamine compounds having the formula: H2NCyH2y-(OC2H4)x-O-CyH2y-NH2 where y is 2 or 3 and x is 1-50.
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