Elektrisches Verbindungsverfahren mit erhöhten Verbindungsmitteln

摘要

A pair of electrical circuits (20, 22), which may be both flexible or one flexible and one rigid, are interconnected by projections, such as bumps (24) and rings (26). The projections are formed from substantially inelastic dielectric material, such as an epoxy, defining bumps (34) and rings (36), which are plated with copper (38). Projections (24, 26) of one circuit are disposed to interconnect with mating projections on the other circuit, the interconnection being bump to bump, bump to ring, or bump to pad. The projections may be formed on a copper-clad substrate (42) or on plated-through holes (72) on a printed wiring board (70). Alternately, polygonal pads (94) on a circuit (90) may be joined to a projection. Further, a plurality of bump projections (106), electrically connected to the same or different circuits, may collectively interconnect with a single oval ring projection (108).