Press-contact type semiconductor devices

摘要

A press-contact type semiconductor device comprising multiple semiconductor substrates (25, 27), the periphery of which being enclosed by the chip frame (41) of insulating resin, a first electrode plate (33) and a second electrode plate (35). The present invention arranges the semiconductor substrates (25, 27) on a plane so as to abut against the chip frame (41) with each other, which is press-contacted from the upper and the lower sides by the first electrode plate (33) and the second electrode plate (35).