发明名称 Micro sensor with plug connections.
摘要 A lead frame forms the base for at least one IC fastened thereto. The first ends of the lead frame are electrically connected to the connections of the IC and encapsulated together with the IC in a plastic housing. The second ends of the lead frame are designed as plug-connection elements projecting out of the housing. <IMAGE>
申请公布号 EP0637081(A3) 申请公布日期 1996.03.20
申请号 EP19940109985 申请日期 1994.06.28
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 JANSSEUNE, LUC;PREINER, PETER
分类号 G01D11/24;G01P1/02;H01L21/56;H01L23/495;H01L43/04;H01R13/66 主分类号 G01D11/24
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