A high density interconnect structure including a spacer structure and a gap

摘要

A high frequency electronic component 16 which is interconnected with other components through a high density interconnect structure sees only an air dielectric constant in the high density interconnect structure because a spacer structure 24 disposed on the electronic component spaces the dielectric 26 of the high density interconnect structure from the surface of the electronic component by a sufficient distance that the higher dielectric constant of the polymer dielectric layers of the high density interconnect structure only minimally affects the operating characteristics of the electronic components. The application is to Monolithic Microwave integrated circuits. The spacer structure is polymerised polyamic acid. More than one interconnect layer may be provided.