Integrated circuit interconnection technique

摘要

Interconnection of each of a plurality of bond sites (14) on a semiconductor chip (10) to a corresponding one of a plurality of metallized areas (16) on a substrate (12) is accomplished via a sheet of anisotropically conductive material (18) sandwiched therebetween. The anisotropically conductive material advantageously has a cutout (24) therein located to expose at least a portion of the substrate lying between a pair of metallized areas (16). The cutout (24) serves to confine a quantity of adhesive (26) deposited therein which serves to secure the chip to the substrate without any physical bond between the metallized areas and the bond sites on the chip while maintaining the anisotropically conductive material in compression.