发明名称 Embossed carrier tape system
摘要 An embossed carrier tape system includes a carrier tape having formed therein a number of pockets spaced at equal intervals longitudinally of the carrier tape for accommodating surface mountable electronic parts. A cover tape extends along the length of the carrier tape in superposition thereover on the side where the pocket opening is provided. The cover tape is provided with an engagement wall adapted to be in contact engagement with the inner walls of the corresponding pockets, and is further provided with a buffer (8) expandable longitudinally of the cover tape and extending transversely of the length of the cover tape at locations over the web portions of the carrier tape between adjacent pockets, whereby the need for adhesively bonding the cover tape and the carrier tape is eliminated. Since the cover tape is secured to the carrier tape only by mechanical engagement, it is easier to remove the cover tape from the carrier tape than to peel the cover tape by rupturing an adhesive bond, so that surface mountable electronic parts may be easily placed in and removed from the pockets. In addition, not only the carrier tape but also the cover tape may be reused because there are no flaws or remnants left on the tapes.
申请公布号 US5499717(A) 申请公布日期 1996.03.19
申请号 US19940312963 申请日期 1994.09.30
申请人 YAYOI CORPORATION 发明人 HAYASHI, TOSHISUMI
分类号 B65D73/02;H05K13/00;(IPC1-7):B65D73/02;B65D85/42 主分类号 B65D73/02
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