| 摘要 |
PURPOSE: To provide a substrate composition wherein an LED array can be positioned correctly and easily and can be connected easily by flip chip bonding. CONSTITUTION: An LED array 2 is mounted in grooves 8 provided in a cathode wiring board, and connected to an anode wiring board 6. The grooves 8 has inclined end faces and positioning in the groove 8 is made by self-alignment at the time of bonding. |
