发明名称 RESIN MOLDING COMPOSITION FOR HIGH-DENSITY PLASTIC FOAM
摘要 PURPOSE: To obtain a resin molding composition for high-density plastic foam which gives a high-density molded plastic foam having about 0.35-0.70g/cm<3> density, excellent in resistances to shock, heat and weather with good extrusion moldability. CONSTITUTION: This resin composition is obtained by admixing 100 pts.wt. of a mixture of comprising (A) 20-80 pts.wt of a vinyl chloride resin of 500-1,700 average polymerization degree and (B) 80-20 pts.wt. of a copolymer prepared by copolymerization of 60-90 pts.wt. of a polymerizable monomer mixture of 20-40wt.% of acrylonitrile, 20-60wt.% ofα-methylstyrene, 20-40wt.% of styrene and 0-40wt.% of a methacrylic ester in the presence of 10-40 pts.wt. of a crosslinked acrylic rubber, to (C) 0.5-30 pts.wt. of an acrylic resin having more than 3.0dl/g reduced viscosity, (D) 0.01-10 pts.wt. of a heat-decomposable foaming agent and (E) 1-10 pts.wt. of stabilizers.
申请公布号 JPH0873641(A) 申请公布日期 1996.03.19
申请号 JP19940238522 申请日期 1994.09.06
申请人 SHIN ETSU CHEM CO LTD 发明人 SUZUKI MAKOTO;MATSUMOTO OSAMU
分类号 C08J9/06;C08J9/00;C08L27/06;C08L33/04;C08L33/06;C08L51/00;C08L51/04;C08L51/06;(IPC1-7):C08J9/06 主分类号 C08J9/06
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