发明名称 |
Traghalterung und Verfahren zur Herstellung der Traghalterung durch feine Oberflächenbearbeitung |
摘要 |
A backing pad be used in a holding jig for holding a semiconductor wafer in the step of mirror polishing comprises a hydrophobic foam, possessed rigidity such that the defference between the thickness, T1, thereof under a load of 300 gf/cm<2> and the thickness, T2, thereof under a load of 1,800 gf/cm<2> (T1 - T2) is in the range of from 1 to 100 mu m, and has holes formed therein in a diameter in the range of 10 to 30 mu m through the wafer-holding surface thereof. The polishing of a semiconductor is effected by a method which comprises preparing a finished backing pad by the precision surface machining operation, setting the semiconductor wafer on a wafer holding jig having a template containing at least one wafer-positioning hole fixed on a carrier plate in such a manner that the backing pad enters the positioning hole , and polishing the semiconductor wafer. <IMAGE> |
申请公布号 |
DE69116720(D1) |
申请公布日期 |
1996.03.14 |
申请号 |
DE1991616720 |
申请日期 |
1991.04.18 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD., TOKIO/TOKYO, JP |
发明人 |
HASHIMOTO, HIROMASA, NISHISHIRAKAWA-GUN, FUKUSHIMA-KEN, JP |
分类号 |
B24B37/04;B24B37/30;H01L21/304;(IPC1-7):H01L21/304;H01L21/68 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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