Test contact e.g. for ball-grid array (BGA) type IC modules

摘要

The test contact for making connection to ball-shaped contacts on ICs consists of a spring support element with a recessed end interacting with the contact where the electrical contact with the IC contact (2) surrounding area (5') of the test contact (3) is composed of two similar spring tongues (4a, 4b). The tips (5a, 5b) of the spring tongues (4a, 4b) are bent outwards to form a recess (5) for the contact (2), where the tongues (4a, 4b) have a raised vertical section (5e, 5f) on the surface area (5c, 5d) making contact with the IC contact (2).