| 摘要 |
<p>PCT No. PCT/FR92/01197 Sec. 371 Date Aug. 9, 1993 Sec. 102(e) Date Aug. 9, 1993 PCT Filed Dec. 17, 1992 PCT Pub. No. WO93/13237 PCT Pub. Date Jul. 8, 1993An element for thermally protecting a substrate is deposited on the substrate and comprises a quasicrystalline aluminum alloy having a thermal diffusivity lower than 2.5x10-6m2/s at room temperature and a thermal diffusivity, within the temperature range 650 DEG -750 DEG C., which does not exceed its thermal diffusivity at room temperature by a factor greater than 3. The element may be used to provide heat barriers or bonding layers for substrates. The heat protection element, used in the form of a heat barrier or in the form of a bond coat for neat barriers, exhibits good thermal insulation properties, good mechanical properties, a low specific mass, good resistance to corrosion, and great ease of processing. Further, the invention is useful in limiting heat transfer towards or from parts and components of fittings in many household and industrial devices, for example, heating or cooking devices, smoothing irons, automobile components, and in aeronautic components. The heat protection element deposited on the substrate consists essentially of a quasicrystalline aluminum alloy consisting essentially of one or a number of quasicrystalline phases which are either a quasicrystalline phase in the strict sense or approximating phases. Such quasicrystalline aluminum alloy has one of the following general compositions: AlaCubFecXdJeIg, AlaPdbMncXdJeTf, Ig, AlaCubCocXdJeTfIg, or AlaXdJeIg.</p> |
