Epoxy resin composition and resin-encapsulated semiconductor device

摘要

An epoxy resin composition comprising (A) an epoxy resin represented by the general formula (1) wherein R1 represents hydrogen, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups or halogen, and X represents and n represents an integer of 0 to 4, and (B) a curing agent, which composition provides a cured product having low hygroscopic property and high adhesiveness.