发明名称 |
Lead frame and process of producing it |
摘要 |
<p>A lead frame (10) includes a plurality of inner leads (12), each of the inner leads having at least one surface (20) defining a bonding area (22) and two opposed side edges. The tip ends of the plurality of inner leads (12) are connected by a connecting part (14, 30) so that the inner leads (12) are arranged side by side with respect to one another. The connecting part (14, 30) is integrally and simultaneously formed with the inner leads (12) by an etching process. Each of the inner leads has recesses (18) on one or two side edges at a position, between the bonding area (22) and the connecting part (14, 30), on a cutting line (16) along which the plurality of inner leads (12) are to be cut and separated into individual inner leads (12). <MATH></p> |
申请公布号 |
EP0701280(A2) |
申请公布日期 |
1996.03.13 |
申请号 |
EP19950305572 |
申请日期 |
1995.08.10 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO. LTD. |
发明人 |
TSUCHIYA, KENICHIRO;IWABUCHI, MASAHIRO;ISHIZAKI, TOSHIAKI |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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