发明名称 DOUBLE-SIDED SUBSTRATE AND ELECTRODE CONNECTION USING BOTH-SIDED SUBSTRATE
摘要 PURPOSE: To stabilize electrode connection quality of a both-sided substrate so as to improve its yield. CONSTITUTION: This both-sided substrate is provided with a metal plate which is a good heat-conducting body and a pre-preg 11 to be laminated on both surfaces of the metal plate 10 for forming a circuit pattern 12 on its surface while being,constituted that a projection part 10a of the metal plate 10 projects from an end face of the pre-preg 11. Thereby, heat for electrode connection can be efficiently supplied to an electrode pad of a semiconductor device 16, which is an electrode connection spot, and a circuit pattern 12 through the projection part 10a.
申请公布号 JPH0870017(A) 申请公布日期 1996.03.12
申请号 JP19940204838 申请日期 1994.08.30
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SAITO HIROSHI;INOUE TOMOHIRO
分类号 H01R43/02;H01L21/60;H05K1/05;H05K3/46 主分类号 H01R43/02
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