发明名称 |
DOUBLE-SIDED SUBSTRATE AND ELECTRODE CONNECTION USING BOTH-SIDED SUBSTRATE |
摘要 |
PURPOSE: To stabilize electrode connection quality of a both-sided substrate so as to improve its yield. CONSTITUTION: This both-sided substrate is provided with a metal plate which is a good heat-conducting body and a pre-preg 11 to be laminated on both surfaces of the metal plate 10 for forming a circuit pattern 12 on its surface while being,constituted that a projection part 10a of the metal plate 10 projects from an end face of the pre-preg 11. Thereby, heat for electrode connection can be efficiently supplied to an electrode pad of a semiconductor device 16, which is an electrode connection spot, and a circuit pattern 12 through the projection part 10a. |
申请公布号 |
JPH0870017(A) |
申请公布日期 |
1996.03.12 |
申请号 |
JP19940204838 |
申请日期 |
1994.08.30 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
SAITO HIROSHI;INOUE TOMOHIRO |
分类号 |
H01R43/02;H01L21/60;H05K1/05;H05K3/46 |
主分类号 |
H01R43/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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