SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PURPOSE: To easily perform test and manufacture and to reduce cost for the semiconductor device of BGA structure and its manufacturing method. CONSTITUTION: A connection part 26 which is electrically connected to an electrode pad 23 of a semiconductor chip 22 is formed on a resin film 24 and is connected to an external pad 28 and an external terminal 30 via a pattern 27 at the upper portion of a semiconductor from the connection part 26. Also, a test pad 29 which is connected via a pattern 27 extended from the connection part is formed at a test region outside the semiconductor chip of the resin film 24 and at the same time a hole 34 for mounting and feeding carriers is formed.