| 摘要 |
<p>PURPOSE: To improve reliability and reduce cost of an LOC structure package type semiconductor device. CONSTITUTION: The device consists of the following; a semiconductor chip 11, leads 13 of a first lead group which retain and fix the chip 11, leads 14 of a second lead group which stretch on the main surface of the chip 11, Au wires 18 which connect tips of the leads 14 with electrodes on the main surface of the chip 11, sealing resin 12 which seals them, and outer leads 17 of the second group leads 14.</p> |
