| 摘要 |
PURPOSE: To improve the productivity of a multilayer printed-wiring board by a method wherein a cured undercoating agent is applied on both surfaces of a double-side copper-clad laminated board subjected to circuit work and after the step of the copper foil of an internal layer circuit is eliminated, an epoxy resin, a multifunctional phenol and a guanide compound-containing prepreg are laminated and pressed on both surfaces of the internal layer circuit. CONSTITUTION: A heat-cured, light-cured or light-heat combined undercoating agent is applied on both surfaces of an internal layer circuit board and after the step of the copper foil of an internal layer circuit is eliminated or reduced, an epoxy resin, which has two pieces or more of epoxy groups in one molecule, a multifunctional phenol and a guanide compound-containing fast-curing prepreg are superposed on both surfaces of the internal layer circuit to laminate and are pressed. As the epoxy resin, a bisphenol A is exemplified, as the multifunctional phenol, a phenolic novolak is exemplified and the guanide compound shows a compound having a guanidine structure. 0.5 to 0.2 equivalent of multifunctional phenol and 0.03 to 0.5 equivalent of guanide compound to one equivalent of epoxy resin are compounded. |
