发明名称 |
Method for mounting lead terminals to circuit board |
摘要 |
Load terminals are mounted to a circuit board by providing a solder layer on each lead terminal and on each conductive inner wall surface of respective holes formed in the circuit board. The lead terminals are thrust into respective holes, and contacting portions of the solder layers are irradiated with an energy beam, to produce sufficient heat for welding in a fluxless manner each lead terminal to the inner wall surface of its respective hole.
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申请公布号 |
US5497546(A) |
申请公布日期 |
1996.03.12 |
申请号 |
US19930120429 |
申请日期 |
1993.09.14 |
申请人 |
MATSUSHITA ELECTRIC WORKS, LTD. |
发明人 |
KUBO, MASAO;KAMADA, KAZUO;OGASAWARA, MASANOBU;NAKAMURA, YOSHIMITSU |
分类号 |
H01L21/48;H01R12/58;H01R43/02;H05K3/32;H05K3/34;(IPC1-7):H01R9/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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